Poly-Bond B55 is white, low-density, polyester-based compound designed to function as a laminating resin as well as a gap filling compound. At a weight of 1/3 less than polyester resin, and when combined with a sandwich core, it achieves low weight sandwich parts with a good profile such as hatches, doors, tabletops, centerboards, rudders, and a variety of small parts where low weight and a gelcoated surface on both sides is important. Such parts are produced in a one-step molding process with low cost tooling. Poly-Bond B55 has an excellent flow with low closing pressures obtained when the mold halves are clamped together. Poly-Bond B55 is catalysed with MEKP, and has a short gel time with fast follow-through for short production cycles. It can be used in bond-line thicknesses up to 1” (25mm). PLEASE CONTACT US FOR POLY-BOND B55/B55LV PROCESS INSTRUCTIONS

Produkt	Dichte in g/m 2	Viskosität/mPas	Fugenstärke	Größe	Härter	Artikelnummer
B55 Poly-Bond	0,68-0,72	110000-120000	1-20	19 Liter/14,4 Kg	MEKP	B55LVRC